Project Summary

Ultra-thin sensors are mounted at the ends of the two high-speed cutting spindles next to the blade holder. They estimate the machine health index (HI) and remaining useful life (RUL) in real time and warn before failure, so the site can carry out planned maintenance in non-production windows.

Pain Points

Wafer dicing is the key step that separates a whole wafer into individual dies. The DISCO DFD6362 cuts to micron precision at tens of thousands of rpm. The high-speed spindle easily develops eccentricity or unbalance, and its precision bearings and cutting blades suffer high-frequency wear. The financial risk of one sudden failure:

The customer relied on the OEM spindle speed feedback. Speed variation has very little correlation with early bearing wear or slight spindle eccentricity, so early anomalies go unnoticed. By the time speed shows an obvious deviation, the structure is often close to burn-out or seizure, with only hours or even minutes of life left, too late to prepare parts and schedule maintenance.

Solution

Alarm and Maintenance Workflow

Benefits

(Note: Financial figures are estimated from public industry reports and typical advanced-node production lines.)

Customer Track Record

Solution

If you are interested in this solution, please contact your local distributor for more information and a quotation. The full case document (in Chinese) is available below.